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Precision Semiconductor Grinding Chandler by SemiGrind Corporation Arizona 480-963-1452
Description: Located in Chandler, Arizona, SemiGrind Corporation 480-963-1452, is a wafer processing company which specializes in the removal of silicon from the back of wafers following conventional semiconductor processing.
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Language: English
Site topics: electronics
InPACT - The Indium Phosphide substrates (InP) Specialist - manufactures and sells InP single crystal wafers for the use in telecommunications and microelectronics ...
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Provide wafering and polishing services of semiconductors and industrial crystals to laboratories and industrial customers.
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Premier Semiconductor Services combines industry expertise with the highest quality standards in providing the most complete offering of backend services available ...
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Poland based silicon wafer manufacturer of diameters 100 to 150mm. Capabilities, dopant types and specifications, online inquiry form.
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3.0 / 5.0, Language: English
Offers wafer grinding, dicing, polishing and flip chip service to transfer wafer dice to tape and reel.
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Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test ...
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3.0 / 5.0, Language: English
合晶科技股份有限公司由來自美國矽谷及國內半導體產業深耕已久的研發團隊所創立而成，目前已成為全球前十大半導體矽晶圓材料供應商之一。主要產品為半導體矽晶圓材料、太陽能電池用矽晶圓材料與LED產業用的藍寶石基板。經營團隊擁有豐富矽晶圓製造經驗並長期重視產品研發，公司致力於提供全球顧客高品質的產品與良好的服務。
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Polishing, lapping, back-lapping, dicing, backgrinding are some of the capabilities of the world's leading company supplying optical polishing services
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3.0 / 5.0, Language: English