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Silicon Wafers
Description: Silicon price for Silicon Wafers 25um to 10mm thick all types and dopants silicon single and double side polsihed and more including, GaAs, Ge, InP, SOI, GaN, Fused Silica, Quartz Wafers, Fused Silica and Quartz Wafers, Ge ...
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Language: English
Site topics: electronics
InPACT - The Indium Phosphide substrates (InP) Specialist - manufactures and sells InP single crystal wafers for the use in telecommunications and microelectronics ...
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Offers wafer grinding, dicing, polishing and flip chip service to transfer wafer dice to tape and reel.
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Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test ...
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合晶科技股份有限公司由來自美國矽谷及國內半導體產業深耕已久的研發團隊所創立而成，目前已成為全球前十大半導體矽晶圓材料供應商之一。主要產品為半導體矽晶圓材料、太陽能電池用矽晶圓材料與LED產業用的藍寶石基板。經營團隊擁有豐富矽晶圓製造經驗並長期重視產品研發，公司致力於提供全球顧客高品質的產品與良好的服務。
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Polishing, lapping, back-lapping, dicing, backgrinding are some of the capabilities of the world's leading company supplying optical polishing services
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